Special Issue on Electro-Mechanical Analysis of Coupled-Engineering Systems

Submission Deadline: Feb. 15, 2020

This special issue currently is open for paper submission and guest editor application.

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Special Issue Flyer (PDF)

  • Special Issue Editor
    • Alireza Babaei
      Department of Mechanical Engineering, University of Kentucky, Lexington, Kentucky, USA
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to fulfill the Guest Editor application.
    • Mina Mohammadzadeh
      University of California Merced, Merced, California, USA
    • Mohammad Haerinia
      Department of Electrical Engineering, University of North Dakota, Grand Forks, North Dakota, USA
    • Masoud Arabghahestani
      Department of Mechanical Engineering, University of Kentucky, Lexington, Kentucky, USA
    • Yasaman Vaghei
      School of Mechatroinc Systems Engineering, Simon Fraser University, British Columbia, Canada
    • Urmia Technology university, Urmia, West Azerbaijan, Iran
    • Kazem Bazesefidpar
      Department of Mechanical Engineering, KTH royal Institute of Technology at Stockholm, Stockholm, Sweden
  • Introduction

    This issue is mainly about mechanical analysis of electro-mechanical elements at both micro and macro-scales. This analysis is supposed to be a comprehensive one mostly based on solid mechanics, fluid mechanics, data analysis, signal processing, and machine learning. However the main focus of the issue will be on mechanical aspects; considerations arisen from Electrical, Chemical and Materials Engineering are very important. It is also to mention that applied mathematics, and engineering mathematics accompanied by numerical methods are also amongst the topics of this issue. Since applications of such systems are pretty wide including Automotive industry, Photonic industry, Aerospace industry, Biomedical and Health care cases; this issue covers an interdisciplinary scope of electro-mechanical elements. One of the aspects of such elements is limited to the consideration in submicron and small-sized dimensions which leads to MEMS technology. Recently, mechanical analyses of MEMS elements have been very attractive among research sector of society besides to the industrial society which is mainly because of the advantages of such systems over traditional systems.
    In details, all concepts of: dynamics, mechanical vibrations, vibration suppression, interaction of dynamics and fluids, electrostatic shocks, fundamentals of Electrical Engineering, material toughness, Material Engineering, stability of systems, data analysis, signal processing, machine learning, numerical methods in Mechanical Engineering, advanced engineering mathematics are included within the scope of this special issue.

    Aims and Scope:

    1. Nonlinear dynamics and vibrations
    2. Interactions of dynamics and fluids, and thermodynamics
    3. Machine learning and data science with signal processing techniques
    4. Numerical and Exact methods in advanced engineering mathematics
    5. Micro and Macro-scale electro-mechanical systems
    6. Multidisciplinary engineering

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.ajmie.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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